Electronic device having display including light sensor

ABSTRACT

An electronic device in various embodiments may include: a front cover forming a front surface of the electronic device; a rear cover forming a rear surface opposite to the front surface; a display placed between the front cover and the rear cover and visually exposed through the front cover; a first camera disposed on the front surface; and a processor operatively connected to the first camera and the display. The display may be divided into a display region and a sensor region when facing the front surface. The display may include: a light-emitting/light-receiving layer including light-emitting diodes disposed in the display region and at least one photodiode disposed in the sensor region; and a filter layer placed between the front cover and the light-emitting/light-receiving layer and including light-emitting filters aligned with the light-emitting diodes in the display region, and at least one light-receiving filter aligned with the at least one photodiode in the sensor region. The processor may be configured to receive, from the at least one photodiode, light information related to light passed through the at least one light-receiving filter to be received by the at least one photodiode, and perform, by the light information, a function related to an image acquired from the first camera to be displayed on the display.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Bypass Continuation Application of InternationalApplication No. PCT/KR2022/007763, which was filed on May 31, 2022, andis based on and claims priority under 35 U.S.C. § 119 to Korean PatentApplication No. 10-2021-0073670, which was filed in the KoreanIntellectual Property Office filed on Jun. 7, 2021, the entiredisclosure of each of which is incorporated herein by reference.

BACKGROUND 1. Field

The disclosure relates generally to an electronic device having adisplay including a light sensor.

2. Description of Related Art

When a camera is used to capture an image of an object, the object inthe image may have a distorted color, which is different from the propercolor thereof, due to an external 20 light source (e.g., a fluorescentlamp, an incandescent lamp, the sun, etc.). To correct this type ofdistortion, automatic white balance (AWB) may be used to determine thepicture quality. For example, an electronic device may include a sensorfor acquiring light information (e.g., an ambient light sensor (ALS), aflicker sensor, an illuminance sensor, etc.). The electronic device mayalso use light information, such as brightness, wavelength, type oflight-emitting light source, etc., to correct images obtained from thecamera, thereby removing color distortion.

An electronic device may include a display that fills the entire frontsurface without a bezel. As result, a front camera and a light sensormay be disposed beneath the display, facing forwards. However, lightinformation acquired by the light sensor may be distorted under theinfluence of the display. Consequently, the distortion by the displaymay adversely affect image correction.

SUMMARY

The disclosure has been made to address at least the above-mentionedproblems and/or disadvantages and to provide at least the advantagesdescribed below.

An aspect of the disclosure is to provide an electronic device that mayacquire accurate light information from a light sensor disposed on adisplay.

Another aspect of the disclosure is to provide an electronic device thatmay acquire accurate light information from a light sensor disposed on adisplay, and may use the acquired light information to perform afunction related to an image to be displayed on the display, after beingacquired from a camera.

In accordance with an aspect of the disclosure, an electronic device mayinclude a front cover forming a front surface of the electronic device;a rear cover forming a rear surface opposite to the front surface; adisplay placed between the front cover and the rear cover and visuallyexposed through the front cover; a first camera disposed on the frontsurface; and a processor operatively connected to the first camera andthe display. The display may be divided into a display region and asensor region when facing the front surface. The display may include: alight-emitting/light-receiving layer including light-emitting diodesdisposed in the display region, and at least one photodiode disposed inthe sensor region; and a filter layer placed between the front cover andthe light-emitting/light-receiving layer and including light-emittingfilters aligned with the light-emitting diodes in the display region,and at least one light-receiving filter aligned with the at least onephotodiode in the sensor region. The processor may be configured toreceive, from the at least one photodiode, light information related tolight passed through the at least one light-receiving filter to bereceived by the at least one photodiode, and perform, by using the lightinformation, a function related to an image acquired from the firstcamera to be displayed on the display.

In accordance with another aspect of the disclosure, an electronicdevice may include: a front cover forming a front surface of theelectronic device; a rear cover forming a rear surface opposite to thefront surface; and a display placed between the front cover and the rearcover, visually exposed through the front cover, and divided into adisplay region and a sensor region for recognizing a light source, whenfacing the front surface. The display may include: alight-emitting/light-receiving layer including light-emitting diodesdisposed in the display region, a first photodiode disposed in a firstsub-sensor region of the sensor region, and a second photodiode disposedin a second sub-sensor region of the sensor region; and a filter layerplaced between the front cover and the light-emitting/light-receivinglayer and including light-emitting filters aligned with thelight-emitting diodes in the display region, a first light-receivingfilter aligned with the first photodiode in the first sub-sensor region,and a second light-receiving filter aligned with the second photodiodein the second sub-sensor region. The first light-receiving filter mayfilter out visible light and infrared light components from lightreceived from the outside through the front cover. The secondlight-receiving filter may filter out a visible light component fromlight received from the outside through the front cover. The firstphotodiode may generate an electrical signal in response to visiblelight and infrared light components having passed through the firstlight-receiving filter. The second photodiode may generate an electricalsignal in response to a visible light component having passed throughthe second light-receiving filter.

According to various embodiment, an electronic device may acquireaccurate light information from a light sensor disposed on a display,and may use the acquired light information to perform a function relatedto an image to be displayed on the display after being acquired from acamera. Various other advantageous effects identified explicitly orimplicitly through the disclosure may be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the disclosurewill be more apparent from the following detailed description taken inconjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram of an electronic device in a networkenvironment, according to various embodiments;

FIG. 2 is a block diagram of a display module according to variousembodiments;

FIGS. 3A and 3B illustrate a position of a light sensor for acquiringlight information in an electronic device, according to an embodiment;

FIGS. 4A and 4B illustrate a display including a light sourcerecognition sensor, according to an embodiment;

FIGS. 5A and 5B illustrate a display including an illuminance sensor,according to an embodiment;

FIGS. 6A, 6B, and 6C illustrate a display including a proximity sensor,according to an embodiment;

FIG. 7 is a block diagram of an electronic device according to variousembodiments; and

FIG. 8 illustrates an execution screen of a camera application displayedon the electronic device of FIG. 7 .

DETAILED DESCRIPTION

Hereinafter, various embodiments will be described in detail withreference to attached drawings. In the disclosure, embodiments aredescribed in the drawings and a related detailed description is setforth, but this is not intended to limit the embodiments of thedisclosure. Descriptions of well-known functions and constructions areomitted for the sake of clarity and conciseness.

FIG. 1 is a block diagram illustrating an electronic device 101 in anetwork environment 100 according to various embodiments.

Referring to FIG. 1 , the electronic device 101 in the networkenvironment 100 may communicate with an electronic device 102 via afirst network 198 (e.g., a short-range wireless communication network),or at least one of an electronic device 104 or a server 108 via a secondnetwork 199 (e.g., a long-range wireless communication network).

According to an embodiment, the electronic device 101 may communicatewith the electronic device 104 via the server 108. According to anembodiment, the electronic device 101 may include a processor 120,memory 130, an input module 150, a sound output module 155, a displaymodule 160, an audio module 170, a sensor module 176, an interface 177,a connecting terminal 178, a haptic module 179, a camera module 180, apower management module 188, a battery 189, a communication module 190,a subscriber identification module (SIM) 196, or an antenna module 197.In some embodiments, at least one of the components (e.g., theconnecting terminal 178) may be omitted from the electronic device 101,or one or more other components may be added in the electronic device101. In some embodiments, some of the components (e.g., the sensormodule 176, the camera module 180, or the antenna module 197) may beimplemented as a single component (e.g., the display module 160).

The processor 120 may execute, for example, software (e.g., a program140) to control at least one other component (e.g., a hardware orsoftware component) of the electronic device 101 coupled with theprocessor 120, and may perform various data processing or computation.According to one embodiment, as at least part of the data processing orcomputation, the processor 120 may store a command or data received fromanother component (e.g., the sensor module 176 or the communicationmodule 190) in volatile memory 132, process the command or the datastored in the volatile memory 132, and store resulting data innon-volatile memory 134. According to an embodiment, the processor 120may include a main processor 121 (e.g., a central processing unit (CPU)or an application processor (AP)), or an auxiliary processor 123 (e.g.,a graphics processing unit (GPU), a neural processing unit (NPU), animage signal processor (ISP), a sensor hub processor, or a communicationprocessor (CP)) that is operable independently from, or in conjunctionwith, the main processor 121. For example, when the electronic device101 includes the main processor 121 and the auxiliary processor 123, theauxiliary processor 123 may be adapted to consume less power than themain processor 121, or to be specific to a specified function. Theauxiliary processor 123 may be implemented as separate from, or as partof the main processor 121.

The auxiliary processor 123 may control at least some of functions orstates related to at least one component (e.g., the display module 160,the sensor module 176, or the communication module 190) among thecomponents of the electronic device 101, instead of the main processor121 while the main processor 121 is in an inactive (e.g., sleep) state,or together with the main processor 121 while the main processor 121 isin an active state (e.g., executing an application). According to anembodiment, the auxiliary processor 123 (e.g., an image signal processoror a communication processor) may be implemented as part of anothercomponent (e.g., the camera module 180 or the communication module 190)functionally related to the auxiliary processor 123. According to anembodiment, the auxiliary processor 123 (e.g., the neural processingunit) may include a hardware structure specified for artificialintelligence model processing. An artificial intelligence model may begenerated by machine learning. Such learning may be performed, e.g., bythe electronic device 101 where the artificial intelligence is performedor via a separate server (e.g., the server 108). Learning algorithms mayinclude, but are not limited to, e.g., supervised learning, unsupervisedlearning, semi-supervised learning, or reinforcement learning. Theartificial intelligence model may include a plurality of artificialneural network layers. The artificial neural network may be a deepneural network (DNN), a convolutional neural network (CNN), a recurrentneural network (RNN), a restricted Boltzmann machine (RBM), a deepbelief network (DBN), a bidirectional recurrent deep neural network(BRDNN), deep Q-network or a combination of two or more thereof but isnot limited thereto. The artificial intelligence model may, additionallyor alternatively, include a software structure other than the hardwarestructure.

The memory 130 may store various data used by at least one component(e.g., the processor 120 or the sensor module 176) of the electronicdevice 101. The various data may include, for example, software (e.g.,the program 140) and input data or output data for a command relatedthereto. The memory 130 may include the volatile memory 132 or thenon-volatile memory 134.

The program 140 may be stored in the memory 130 as software, and mayinclude, for example, an operating system (OS) 142, middleware 144, oran application 146.

The input module 150 may receive a command or data to be used by anothercomponent (e.g., the processor 120) of the electronic device 101, fromthe outside (e.g., a user) of the electronic device 101. The inputmodule 150 may include, for example, a microphone, a mouse, a keyboard,a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The sound output module 155 may output sound signals to the outside ofthe electronic device 101. The sound output module 155 may include, forexample, a speaker or a receiver. The speaker may be used for generalpurposes, such as playing multimedia or playing record. The receiver maybe used for receiving incoming calls. According to an embodiment, thereceiver may be implemented as separate from, or as part of the speaker.

The display module 160 may visually provide information to the outside(e.g., a user) of the electronic device 101. The display module 160 mayinclude, for example, a display, a hologram device, or a projector andcontrol circuitry to control a corresponding one of the display,hologram device, and projector. According to an embodiment, the displaymodule 160 may include a touch sensor adapted to detect a touch, or apressure sensor adapted to measure the intensity of force incurred bythe touch.

The audio module 170 may convert a sound into an electrical signal andvice versa. According to an embodiment, the audio module 170 may obtainthe sound via the input module 150, or output the sound via the soundoutput module 155 or a headphone of an external electronic device (e.g.,an electronic device 102) directly (e.g., wiredly) or wirelessly coupledwith the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power ortemperature) of the electronic device 101 or an environmental state(e.g., a state of a user) external to the electronic device 101, andthen generate an electrical signal or data value corresponding to thedetected state. According to an embodiment, the sensor module 176 mayinclude, for example, a gesture sensor, a gyro sensor, an atmosphericpressure sensor, a magnetic sensor, an acceleration sensor, a gripsensor, a proximity sensor, a color sensor, an infrared (IR) sensor, abiometric sensor, a temperature sensor, a humidity sensor, or anilluminance sensor.

The interface 177 may support one or more specified protocols to be usedfor the electronic device 101 to be coupled with the external electronicdevice (e.g., the electronic device 102) directly (e.g., wiredly) orwirelessly. According to an embodiment, the interface 177 may include,for example, a high definition multimedia interface (HDMI), a universalserial bus (USB) interface, a secure digital (SD) card interface, or anaudio interface.

A connecting terminal 178 may include a connector via which theelectronic device 101 may be physically connected with the externalelectronic device (e.g., the electronic device 102). According to anembodiment, the connecting terminal 178 may include, for example, anHDMI connector, a USB connector, an SD card connector, or an audioconnector (e.g., a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanicalstimulus (e.g., a vibration or a movement) or electrical stimulus whichmay be recognized by a user via his tactile sensation or kinestheticsensation. According to an embodiment, the haptic module 179 mayinclude, for example, a motor, a piezoelectric element, or an electricstimulator.

The camera module 180 may capture a still image or moving images.According to an embodiment, the camera module 180 may include one ormore lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to theelectronic device 101. According to one embodiment, the power managementmodule 188 may be implemented as at least part of, for example, a powermanagement integrated circuit (PMIC).

The battery 189 may supply power to at least one component of theelectronic device 101. According to an embodiment, the battery 189 mayinclude, for example, a primary cell which is not rechargeable, asecondary cell which is rechargeable, or a fuel cell.

The communication module 190 may support establishing a direct (e.g.,wired) communication channel or a wireless communication channel betweenthe electronic device 101 and the external electronic device (e.g., theelectronic device 102, the electronic device 104, or the server 108) andperforming communication via the established communication channel. Thecommunication module 190 may include one or more communicationprocessors that are operable independently from the processor 120 (e.g.,the application processor (AP)) and supports a direct (e.g., wired)communication or a wireless communication. According to an embodiment,the communication module 190 may include a wireless communication module192 (e.g., a cellular communication module, a short-range wirelesscommunication module, or a global navigation satellite system (GNSS)communication module) or a wired communication module 194 (e.g., a localarea network (LAN) communication module or a power line communication(PLC) module). A corresponding one of these communication modules maycommunicate with the external electronic device via the first network198 (e.g., a short-range communication network, such as Bluetooth™,wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA))or the second network 199 (e.g., a long-range communication network,such as a legacy cellular network, a 5G network, a next-generationcommunication network, the Internet, or a computer network (e.g., LAN orwide area network (WAN)). These various types of communication modulesmay be implemented as a single component (e.g., a single chip), or maybe implemented as multi components (e.g., multi chips) separate fromeach other.

The wireless communication module 192 may identify and authenticate theelectronic device 101 in a communication network, such as the firstnetwork 198 or the second network 199, using subscriber information(e.g., international mobile subscriber identity (IMSI)) stored in thesubscriber identification module 196.

The wireless communication module 192 may support a 5G network, after a4G network, and next-generation communication technology, e.g., newradio (NR) access technology. The NR access technology may supportenhanced mobile broadband (eMBB), massive machine type communications(mMTC), or ultra-reliable and low-latency communications (URLLC). Thewireless communication module 192 may support a high-frequency band(e.g., the mmWave band) to achieve, e.g., a high data transmission rate.

The wireless communication module 192 may support various technologiesfor securing performance on a high-frequency band, such as, e.g.,beamforming, massive multiple-input and multiple-output (massive MIMO),full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, orlarge scale antenna. The wireless communication module 192 may supportvarious requirements specified in the electronic device 101, an externalelectronic device (e.g., the electronic device 104), or a network system(e.g., the second network 199). According to an embodiment, the wirelesscommunication module 192 may support a peak data rate (e.g., 20 Gbps ormore) for implementing eMBB, loss coverage (e.g., 164 dB or less) forimplementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each ofdownlink (DL) and uplink (UL), or a round trip of 1 ms or less) forimplementing URLLC.

The antenna module 197 may transmit or receive a signal or power to orfrom the outside (e.g., the external electronic device) of theelectronic device 101. According to an embodiment, the antenna module197 may include an antenna including a radiating element composed of aconductive material or a conductive pattern formed in or on a substrate(e.g., a printed circuit board (PCB)). According to an embodiment, theantenna module 197 may include a plurality of antennas (e.g., arrayantennas). In such a case, at least one antenna appropriate for acommunication scheme used in the communication network, such as thefirst network 198 or the second network 199, may be selected, forexample, by the communication module 190 (e.g., the wirelesscommunication module 192) from the plurality of antennas. The signal orthe power may then be transmitted or received between the communicationmodule 190 and the external electronic device via the selected at leastone antenna. According to an embodiment, another component (e.g., aradio frequency integrated circuit (RFIC)) other than the radiatingelement may be additionally formed as part of the antenna module 197.

According to various embodiments, the antenna module 197 may form ammWave antenna module. According to an embodiment, the mmWave antennamodule may include a printed circuit board, an RFIC disposed on a firstsurface (e.g., the bottom surface) of the printed circuit board, oradjacent to the first surface and capable of supporting a designatedhigh-frequency band (e.g., the mmWave band), and a plurality of antennas(e.g., array antennas) disposed on a second surface (e.g., the top or aside surface) of the printed circuit board, or adjacent to the secondsurface and capable of transmitting or receiving signals of thedesignated high-frequency band.

At least some of the above-described components may be coupled mutuallyand communicate signals (e.g., commands or data) therebetween via aninter-peripheral communication scheme (e.g., a bus, general purposeinput and output (GPIO), serial peripheral interface (SPI), or mobileindustry processor interface (MIPI)).

According to an embodiment, commands or data may be transmitted orreceived between the electronic device 101 and the external electronicdevice 104 via the server 108 coupled with the second network 199. Eachof the electronic devices 102 or 104 may be a device of a same type as,or a different type, from the electronic device 101. According to anembodiment, all or some of operations to be executed at the electronicdevice 101 may be executed at one or more of the external electronicdevices 102, 104, or 108. For example, if the electronic device 101should perform a function or a service automatically, or in response toa request from a user or another device, the electronic device 101,instead of, or in addition to, executing the function or the service,may request the one or more external electronic devices to perform atleast part of the function or the service. The one or more externalelectronic devices receiving the request may perform the at least partof the function or the service requested, or an additional function oran additional service related to the request, and transfer an outcome ofthe performing to the electronic device 101. The electronic device 101may provide the outcome, with or without further processing of theoutcome, as at least part of a reply to the request. To that end, acloud computing, distributed computing, mobile edge computing (MEC), orclient-server computing technology may be used, for example. Theelectronic device 101 may provide ultra low-latency services using,e.g., distributed computing or MEC. In another embodiment, the externalelectronic device 104 may include an internet-of-things (IoT) device.The server 108 may be an intelligent server using machine learningand/or a neural network. According to an embodiment, the externalelectronic device 104 or the server 108 may be included in the secondnetwork 199. The electronic device 101 may be applied to intelligentservices (e.g., smart home, smart city, smart car, or healthcare) basedon 5G communication technology or IoT-related technology.

FIG. 2 is a block diagram 200 illustrating the display module 160according to various embodiments.

Referring to FIG. 2 , the display module 160 may include a display 210and a display driver integrated circuit (DDI) 230 to control the display210. The DDI 230 may include an interface module 231, memory 233 (e.g.,buffer memory), an image processing module 235, or a mapping module 237.The DDI 230 may receive image information that contains image data or animage control signal corresponding to a command to control the imagedata from another component of the electronic device 101 via theinterface module 231. For example, according to an embodiment, the imageinformation may be received from the processor 120 (e.g., the mainprocessor 121 (e.g., an application processor)) or the auxiliaryprocessor 123 (e.g., a graphics processing unit) operated independentlyfrom the function of the main processor 121. The DDI 230 maycommunicate, for example, with touch circuitry 250 or the sensor module176 via the interface module 231. The DDI 230 may also store at leastpart of the received image information in the memory 233, for example,on a frame by frame basis.

The image processing module 235 may perform pre-processing orpost-processing (e.g., adjustment of resolution, brightness, or size)with respect to at least part of the image data. According to anembodiment, the pre-processing or post-processing may be performed, forexample, based at least in part on one or more characteristics of theimage data or one or more characteristics of the display 210.

The mapping module 237 may generate a voltage value or a current valuecorresponding to the image data pre-processed or post-processed by theimage processing module 235. According to an embodiment, the generatingof the voltage value or current value may be performed, for example,based at least in part on one or more attributes of the pixels (e.g., anarray, such as an RGB stripe or a pentile structure, of the pixels, orthe size of each subpixel). At least some pixels of the display 210 maybe driven, for example, based at least in part on the voltage value orthe current value such that visual information (e.g., a text, an image,or an icon) corresponding to the image data may be displayed via thedisplay 210.

According to an embodiment, the display module 160 may further includethe touch circuitry 250. The touch circuitry 250 may include a touchsensor 251 and a touch sensor IC 253 to control the touch sensor 251.The touch sensor IC 253 may control the touch sensor 251 to sense atouch input or a hovering input with respect to a certain position onthe display 210. To achieve this, for example, the touch sensor 251 maydetect (e.g., measure) a change in a signal (e.g., a voltage, a quantityof light, a resistance, or a quantity of one or more electric charges)corresponding to the certain position on the display 210. The touchcircuitry 250 may provide input information (e.g., a position, an area,a pressure, or a time) indicative of the touch input or the hoveringinput detected via the touch sensor 251 to the processor 120. Accordingto an embodiment, at least part (e.g., the touch sensor IC 253) of thetouch circuitry 250 may be formed as part of the display 210 or the DDI230, or as part of another component (e.g., the auxiliary processor 123)disposed outside the display module 160.

According to an embodiment, the display module 160 may further includeat least one sensor (e.g., a fingerprint sensor, an iris sensor, apressure sensor, or an illuminance sensor) of the sensor module 176 or acontrol circuit for the at least one sensor. In such a case, the atleast one sensor or the control circuit for the at least one sensor maybe embedded in one portion of a component (e.g., the display 210, theDDI 230, or the touch circuitry 250)) of the display module 160. Forexample, when the sensor module 176 embedded in the display module 160includes a biometric sensor (e.g., a fingerprint sensor), the biometricsensor may obtain biometric information (e.g., a fingerprint image)corresponding to a touch input received via a portion of the display210. As another example, when the sensor module 176 embedded in thedisplay module 160 includes a pressure sensor, the pressure sensor mayobtain pressure information corresponding to a touch input received viaa partial or whole area of the display 210. According to an embodiment,the touch sensor 251 or the sensor module 176 may be disposed betweenpixels in a pixel layer of the display 210, or over or under the pixellayer.

The electronic device according to various embodiments may be one ofvarious types of electronic devices. The electronic devices may include,for example, a portable communication device (e.g., a smartphone), acomputer device, a portable multimedia device, a portable medicaldevice, a camera, a wearable device, or a home appliance. According toan embodiment of the disclosure, the electronic devices are not limitedto those described above.

It should be appreciated that various embodiments of the presentdisclosure and the terms used therein are not intended to limit thetechnological features set forth herein to particular embodiments andinclude various changes, equivalents, or replacements for acorresponding embodiment. With regard to the description of thedrawings, similar reference numerals may be used to refer to similar orrelated elements. It is to be understood that a singular form of a nouncorresponding to an item may include one or more of the things, unlessthe relevant context clearly indicates otherwise. As used herein, eachof such phrases as “A or B,” “at least one of A and B,” “at least one ofA or B,” “A, B, or C,” “at least one of A, B, and C,” and “at least oneof A, B, or C,” may include any one of, or all possible combinations ofthe items enumerated together in a corresponding one of the phrases. Asused herein, such terms as “1st” and “2nd,” or “first” and “second” maybe used to simply distinguish a corresponding component from another,and does not limit the components in other aspect (e.g., importance ororder). It is to be understood that if an element (e.g., a firstelement) is referred to, with or without the term “operatively” or“communicatively”, as “coupled with,” “coupled to,” “connected with,” or“connected to” another element (e.g., a second element), it means thatthe element may be coupled with the other element directly (e.g.,wiredly), wirelessly, or via a third element.

As used in connection with various embodiments of the disclosure, theterm “module” may include a unit implemented in hardware, software, orfirmware, and may interchangeably be used with other terms, for example,“logic,” “logic block,” “part,” or “circuitry”. A module may be a singleintegral component, or a minimum unit or part thereof, adapted toperform one or more functions. For example, according to an embodiment,the module may be implemented in a form of an application-specificintegrated circuit (ASIC).

Various embodiments as set forth herein may be implemented as software(e.g., the program 140) including one or more instructions that arestored in a storage medium (e.g., internal memory 136 or external memory138) that is readable by a machine (e.g., the electronic device 101).For example, a processor (e.g., the processor 120) of the machine (e.g.,the electronic device 101) may invoke at least one of the one or moreinstructions stored in the storage medium, and execute it, with orwithout using one or more other components under the control of theprocessor. This allows the machine to be operated to perform at leastone function according to the at least one instruction invoked. The oneor more instructions may include a code generated by a complier or acode executable by an interpreter. The machine-readable storage mediummay be provided in the form of a non-transitory storage medium. Wherein,the term “non-transitory” simply means that the storage medium is atangible device, and does not include a signal (e.g., an electromagneticwave), but this term does not differentiate between where data issemi-permanently stored in the storage medium and where the data istemporarily stored in the storage medium.

According to an embodiment, a method according to various embodiments ofthe disclosure may be included and provided in a computer programproduct. The computer program product may be traded as a product betweena seller and a buyer. The computer program product may be distributed inthe form of a machine-readable storage medium (e.g., compact disc readonly memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded)online via an application store (e.g., PlayStore™), or between two userdevices (e.g., smart phones) directly. If distributed online, at leastpart of the computer program product may be temporarily generated or atleast temporarily stored in the machine-readable storage medium, such asmemory of the manufacturer's server, a server of the application store,or a relay server.

According to various embodiments, each component (e.g., a module or aprogram) of the above-described components may include a single entityor multiple entities, and some of the multiple entities may beseparately disposed in different components. According to variousembodiments, one or more of the above-described components may beomitted, or one or more other components may be added. Alternatively oradditionally, a plurality of components (e.g., modules or programs) maybe integrated into a single component. In such a case, according tovarious embodiments, the integrated component may still perform one ormore functions of each of the plurality of components in the same orsimilar manner as they are performed by a corresponding one of theplurality of components before the integration. According to variousembodiments, operations performed by the module, the program, or anothercomponent may be carried out sequentially, in parallel, repeatedly, orheuristically, or one or more of the operations may be executed in adifferent order or omitted, or one or more other operations may beadded.

Various housing structures may be applied to the electronic device 101.For example, the electronic device 101 may have a bar-type housingstructure. The bar-type housing structure may include a plate forming afront surface of the electronic device 101, a plate forming a rearsurface of the electronic device 101, and a bezel structure forming aside surface surrounding the front and rear surfaces. A display may bedisposed on the front surface. As another example, the electronic device101 may have a foldable housing structure that is divided into twohousings about a folding axis. A first display region of a display(e.g., a flexible display) may be disposed in the first housing, and asecond display region of the display may be disposed in the secondhousing. The foldable housing structure may be implemented in anin-folding type in which the first display region and the second displayregion face each other when the electronic device 101 is in a foldedstate. Alternatively, the foldable housing structure may be implementedin an out-folding type in which the first display region and the seconddisplay region face in opposite directions to each other when theelectronic device 101 is in a folded state. As another example, theelectronic device 101 may have a slidable (or rollable) housingstructure. For example, the electronic device 101 may include a slidablehousing structure including a first housing and a second housing, aroller (or slider) for allowing a part of the second housing to be drawninto or drawn out from the first housing, and a flexible display. Thedisplay may be disposed in a space formed by the slidable housingstructure. The display may include the first display region disposedadjacent to the first housing and the second display region disposed onthe inner space while surrounding the roller. In an electronic devicehaving a foldable housing structure or a slidable housing structure, asurface from which the flexible display is visually exposed may bedefined as a front surface. The opposite surface of the front surfacemay be defined as a rear surface of the electronic device. In addition,a surface surrounding a space between the front surface and the rearsurface may be defined as a side surface of the electronic device.

FIGS. 3A and 3B illustrate a position of a sensor for acquiring lightinformation in the electronic device 300 (e.g., the electronic device101 of FIG. 1 ) according to an exemplary embodiment.

Referring to FIGS. 3A and 3B, the electronic device 300 (e.g., theelectronic device 101 of FIG. 1 ) may include a side bezel structure (ora side frame) 310, a first support member (or a first support frame)311, a front plate (or a front cover) 320, a display 330 (e.g., thedisplay module 160 of FIG. 1 ), at least one printed circuit board 340and 341, a battery 350 (e.g., the battery 189 of FIG. 1 ), a secondsupport member (or a second support frame) 360, and a rear plate (or arear cover) 380. The front plate 320 may form a first surface (or afront surface) of the electronic device 300 facing in a first direction,the rear plate 380 may form a second surface (or a rear surface) of theelectronic device 300 facing in a second direction opposite to the firstdirection, and the side bezel structure 310 may be configured by acombination of a metal (e.g., SUS) and a polymer and may form a sidesurface surrounding a space between the first surface and the secondsurface. According to an embodiment, a structure including the firstsurface, the second surface, and the side surface may be referred to asa housing (or a housing structure). In some embodiments, at least one ofthe elements (e.g., the first support member 311 or the second supportmember 360 of the electronic device 300 may be omitted or anotherelement may be added to the electronic device 300.

The printed circuit boards 340 and 341 may be disposed to be supportedby the first support member 311 and/or the second support member 360.The first support member 311 may be coupled to the side bezel structure310. The first support member 311 may include a structure (e.g., a metalor a polymer) extending from the side bezel structure 310. The firstsupport member 311 may be formed of, for example, a metal and/or anon-metal material (e.g., a polymer). The display 330 may be coupled toone surface of the second support member 360 and the printed circuitboards 340 and 341 may be coupled to the other surface thereof. Theprinted circuit boards 340 and 341 may be equipped with a processor 120,a memory 130, and/or an interface 177. According to an embodiment, theprinted circuit boards 340 and 341 may include a main board 340 and asub-board 341. The first support member 311 may include a main substratesupport member 311 a configured to support the main substrate 340, and asub-substrate support member 311 b configured to support thesub-substrate 341. The processor 120 may include, for example, one ormore of a central processing unit, an application processor, a graphicprocessing unit, an image signal processor, a sensor hub processor, anda communication processor. The memory 130 may include, for example, avolatile memory or a non-volatile memory.

The battery 350 may be disposed to be supported by the first supportmember 311 and/or the second support member 360. The battery 350, whichis a device for supplying power to at least one element of theelectronic device 300, may include, for example, a non-rechargeableprimary battery, a rechargeable secondary battery, or a fuel cell. Atleast a portion of the battery 350 may be disposed on, for example,substantially the same plane as the printed circuit boards 340 and 341.

The display 330 may include a light sensor configured by a combinationof a filter and a photodiode. The filter may filter a specified lightcomponent within a wavelength band from light incident to the filterthrough the front cover (e.g., a coating layer, or ultra-thin glass(UTG)) 320. The photodiode paired with the filter may respond to a lightcomponent having passed through the filter. For example, the photodiodemay generate an electrical signal (e.g., current) corresponding to alight component having passed through the filter. An analog to digitalconverter (ADC) (not shown) may convert an electrical signal generatedby the photodiode into a digital signal and transmit the digital signalto the processor 120. For example, the digital signal may be stored in abuffer before being transmitted to the processor 120. The digital signalmay be transmitted to the processor 120 through the buffer in a first infirst out (FIFO) method in which data first input to the buffer is firstoutput. For example, when the light intensity is strong, data having alarge value may be output from the ADC to the processor 120 through thebuffer. When the light intensity is relatively low, data having a smallvalue may be output from the ADC to the processor 120 through thebuffer.

The display 330 may include a light sensor (e.g., an ambient lightsensor (ALS), and a flicker sensor) (hereinafter, referred to as a lightsource recognition sensor) for recognizing a light source type (e.g., afluorescent lamp, an incandescent lamp, and sunlight) and/or a lightsensor (hereinafter, an illuminance sensor) for measuring theilluminance around the electronic device 300. Intensity of infraredlight (a light component having a wavelength band of about 700 to 1100nm) may be different according to each light source type. For example, afluorescent lamp may have weaker infrared light compared to sunlight. Anincandescent lamp may have strong infrared light compared to sunlight.Accordingly, the light source recognition sensor may be configured by acombination of a photodiode and a filter capable of acquiring infraredintensity. The light source recognition sensor may include a combinationof a filter (hereinafter, a broadband filter) which filters spectrumlight (e.g., a light component having a wavelength band of about 300 to1100 nm) including infrared light and visible light (a light componenthaving a wavelength band of about 400 to 700 nm) and a photodiode whichresponds to light having passed through the broadband filter, and acombination of a visible light filter and a photodiode which responds tovisible light. Alternatively, the light source recognition sensor mayinclude a combination of an infrared filter and a photodiode whichresponds to infrared light. The human eye can respond most sensitivelyto G among R (red), G (green), and B (blue). Accordingly, theilluminance sensor may include a combination of a filter which filtersgreen color-based light (about 450 to 650 nm) and a photodiode whichresponds to green. The processor 120 may correct an image by using datareceived from a light sensor (e.g., a light source recognition sensorand/or an illuminance sensor) through the ADC and display the correctedimage on the display 330.

The display 330 may include a light sensor (hereinafter, a proximitysensor) configured to recognize an object which is close to theelectronic device 300 and calculate a distance between the electronicdevice 300 and the object adjacent thereto. The proximity sensor mayfurther include a light-emitting diode that generates light (e.g.,infrared light and/or green light) in a wavelength band designated topass through a filter. For example, when the light generated from thelight-emitting diode of the proximity sensor passes through the filterof the proximity sensor and is reflected by the object to reach thephotodiode of the proximity sensor through the filter, data indicatingthe proximity of the object may be transmitted the processor 120 to thephotodiode of the proximity sensor through the ADC. The processor 120may recognize the proximity of the object and calculate a distancebetween the object and the electronic device 300, based on the datatransmitted from the proximity sensor through the ADC. For example, theprocessor 120 may calculate a value representing a distance between theobject and the electronic device 300 by using a time difference betweena time point at which light is emitted through the light-emitting diodeand a time point at which the light is received through the photodiode.

Referring to FIG. 3B, a light sensor may be disposed in various placeson the display 330. For example, when the front cover 320 is viewed fromthe front, the front camera 370 may be disposed under the upper end ofthe front cover 320. The light sensor may be disposed in a display upperregion 331 of the display 330, which is placed under the upper end ofthe front cover 320, such that the same does not overlap the frontcamera 370. In addition to the display upper region 331, the lightsensor may be disposed in a display lower region 332, a display leftregion 333, or a display right region 334.

FIGS. 4A and 4B illustrate a display including a light sourcerecognition sensor according to an embodiment. FIG. 4A illustrates adisplay region 400 including a light source recognition sensor in thedisplay 330 of FIG. 3A, and FIG. 4B is a cross-sectional view takenalong a portion AB in the z-axis direction in the display region 400 ofFIG. 4A.

Referring to FIG. 4A, the display region 400 may include a plurality ofpixel regions and at least one light source recognition sensor regionwhen viewed in the z-axis direction. A combination of sub-pixel regionsmay be defined as one pixel region 410. For example, an RGBG patternstructure configured by a combination of an R (red) sub-pixel region 410a, a G (green) sub-pixel region 410 b, a B (blue) sub-pixel region 410c, and a G (green) sub-pixel region 410 d may be defined as one pixelregion 410. In addition to the RGBG pixel structure as illustrated,another pixel structure (e.g., an RGB stripe structure and a diamondstructure) may be defined as one pixel region. A plurality of sub-lightsource recognition sensor regions spaced apart from each other may bedefined as one light source recognition sensor region 420. For example,a combination of a first sub-light source recognition sensor region 420a for receiving light in a wideband (e.g., about 300 to 1100 nm) and asecond sub-light source recognition sensor region 420 b for receivingvisible light may be defined as one light source recognition sensorregion 420. A remaining portion of the display region 400 other than thepixel region and the light source recognition sensor region may beformed of, for example, a thin film encapsulation (TFE).

Referring to FIG. 4B, the display 330 may be attached to the front cover320 by using a first adhesive (e.g., a resin) 401. The display 330 mayinclude an auxiliary layer 430, a substrate layer 440, a planarizationlayer 450, a light-emitting/light-receiving layer 460, and a filterlayer 470.

The auxiliary layer 430 may be included in the display 330 as a meansfor reinforcing the rigidity of the display 330 (e.g., the substratelayer 440). For example, the auxiliary layer 430 may be made of at leastone of polyethylene terephthalate (PET) and polyimide (P1).

The substrate layer 440 may be attached to the auxiliary layer 430. Adriving circuit for driving the light-emitting diodes formed in thelight-emitting/light-receiving layer 460 and a receiving circuit forreceiving an electrical signal from the photodiodes formed in thelight-emitting/light-receiving layer 460 may be formed on the substratelayer 440. For example, low-temperature polycrystalline silicon (LTPS)or low-temperature polycrystalline oxide (LTPO) may be used as amaterial of the substrate layer 440.

The planarization layer 450 may be formed on the substrate layer 440such that an electrode is planarized on thelight-emitting/light-receiving layer 460. For example, the planarizationlayer 450 may be formed on the substrate layer 440 by a spin coatingprocess in which an organic material is applied and coated onto thesubstrate layer 440.

The light-emitting/light-receiving layer 460 may include light-emittingdiodes 461 a and 461 b, light-emitting diode electrodes (or sub-pixelelectrodes) 462 a and 462 b, a first photodiode 463 a, a secondphotodiode 463 b, a first photodiode electrode 464 a, a secondphotodiode electrode 464 b, a first insulation layer 465, and a commonelectrode 466.

The light-emitting diodes (e.g., active matrix organic light-emittingdiodes (AMOLEDs) 461 a and 461 b) each as a sub-pixel may emit lighthaving one color (e.g., G) from among R, G, and B. Light generated fromthe light-emitting diodes 461 a and 461 b may be output to the outsideof the display through the sub-pixel regions 467 a and 467 b.Light-emitting diode electrodes (e.g., anodes) 462 a and 462 b may beformed on the planarization layer 450 through, for example, a depositionprocess. The light-emitting diodes 461 a and 461 b may be respectivelyformed on the light-emitting diode electrodes 462 a and 462 b through,for example, a deposition process.

The first photodiode 463 a may receive light in a broad band (e.g.,about 300 to 1100 nm) including visible light and infrared light throughthe first sub-light source recognition sensor region 420 a. The firstphotodiode electrode 464 a may be formed on the planarization layer 450through, for example, a deposition process. The first photodiode 463 amay be formed on the first photodiode electrode 464 a through, forexample, a deposition process. The first photodiode 463 a may beimplemented as an organic photodiode.

The second photodiode 463 b may receive visible light through the secondsub-light source recognition sensor region 420 b. The second photodiodeelectrode 464 b may be formed on the planarization layer 450 through,for example, a deposition process. The second photodiode 463 b may beformed on the second photodiode electrode 464 b through, for example, adeposition process. The second photodiode 463 b may be implemented as anorganic photodiode.

The electrodes 462 a, 462 b, 464 a, 464 b may be electrically connectedto a circuit formed on the substrate 440 through conductive vias 480.

The diodes 461 a, 461 b, 463 a, and 463 b may be partitioned by a firstinsulation layer 465. A common electrode (e.g., a cathode) 466 may beformed on the diodes 461 a, 461 b, 463 a, and 463 b.

The filter layer 470 may be attached to thelight-emitting/light-receiving layer 460 by using a second adhesive(e.g., a resin) 402. The filter layer 470 may include light filters(hereinafter, light-emitting filters) 471 a and 471 b that are pairedwith the light-emitting diodes 461 a and 461 b, respectively, and lightfilters (hereinafter, light-receiving filters) 473 a and 473 b that arepaired with the photodiodes 463 a and 463 b, respectively.

The light filters 471 a, 471 b, 473 a, and 473 b may be partitioned by asecond insulation layer 475. Each of the second insulation layer 475 maybe referred to as a pixel define layer together with the firstinsulation layer 465. The insulation layers 465 and 475 may include alight blocking member (e.g., an organic material made of an opaque(e.g., black) material) for blocking light generated from thelight-emitting diode from being incident onto the photodiode. Forexample, the light blocking member included in the first insulationlayer 465 may include, a first insulation portion 465 a placed betweenthe first photodiode 463 a and the first light-emitting diode 461 a, asecond insulation portion 465 b placed between the first light-emittingdiode 461 a and the second photodiode 463 b, and a third insulationportion 465 c placed between the second photodiode 463 b and the secondlight-emitting diode 461 b. The light blocking member included in thesecond insulation layer 475 may be formed in a fourth insulation portion475 a placed between the first light-receiving filter 473 a and thefirst light-emitting filter 471 a, a fifth insulation portion 475 bplaced between the first light-emitting filter 471 a and the secondlight-receiving filter 473 b, and a sixth insulation portion 475 cplaced between the second light-receiving filter 473 b and the secondlight-emitting filter 471 b. Additionally, referring to FIG. 4B, in theadhesives 401 and 402, the light blocking member may also be formed inadhesive components 401 a and 402 a placed on the upper and the lowerportion of the fourth insulation portion 475 a, adhesive components 401b and 402 b placed on the upper and the lower portion of the fifthinsulation portion 475 b, and/or adhesive components 401 c and 402 cplaced on the upper and the lower portion of the sixth insulationportion 475 c.

The light-emitting filters 471 a and 471 b may be aligned with thelight-emitting diodes 461 a and 461 b, respectively, and filter light ofa color generated from the light-emitting diodes 461 a and 461 b. Forexample, light-emitting diodes 461 a and 461 b disposed under thelight-emitting filters 471 a and 471 b to be aligned therewith are GLEDs, and thus the light-emitting filters 471 a and 471 b may be Gfilters through which green color-based light passes.

The first light-receiving filter 473 a may be aligned with the firstphotodiode 463 a and filter light received from the first photodiode 463a. For example, the first light-receiving filter 473 a may filter outvisible light and IR components from light entering through the firstsub-light source recognition sensor region 420 a to output the visiblelight and IR components to the first photodiode 463 a.

The second light-receiving filter 473 b may be aligned with the secondphotodiode 463 b and filter light received from the second photodiode463 b. For example, the second light-receiving filter 473 a may reflector absorb IR from light entering through the second sub-light sourcerecognition sensor region 420 b and filter out a visible light componentto output the visible light component to the second photodiode 463 b.

The first photodiode 463 a and the first light-receiving filter 473 amay be aligned with each other in the first sub-light source recognitionsensor region 420 a when viewed in the z-axis direction. Accordingly,the first light-receiving filter 473 a may filter out visible light andIR components from light having entered the first sub-light sourcerecognition sensor region 420 a of the display 330 from the outside tooutput the visible light and IR components to the first photodiode 463a. The first photodiode 463 a may convert the visible light and IRcomponents into electrical signals corresponding thereto and output thesignals to the processor through the ADC and the buffer.

The second photodiode 463 b and the second light-receiving filter 473 bmay be aligned with each other in the second sub-light sourcerecognition sensor region 420 b when viewed in the z-axis direction.Accordingly, the second light-receiving filter 473 b may filter outvisible light from light having entered the second sub-light sourcerecognition sensor region 420 b of the display 330 from the outside andoutput the visible light to the second photodiode 463 b. The secondphotodiode 463 a may convert the visible light component into anelectrical signal corresponding thereto and output the signal to theprocessor through the ADC and the buffer.

The light source recognition sensor 490 may be implemented by acombination of the first photodiode 463 a and the first light-receivingfilter 473 a and a combination of the second photodiode 463 b and thesecond light-receiving filter 473 b. The light source recognition sensor490 may be freely placed in various locations on the display 330.

FIGS. 5A and 5B illustrate a display including an illuminance sensor,according to an embodiment. FIG. 5A illustrates a display region 500including an illuminance sensor in the display 330 of FIG. 3A, and FIG.5B is a cross-sectional view taken along a portion CD in the z-axisdirection in the display region 500 of FIG. 5A. In describing FIGS. 5Aand 5B, descriptions of an element and a structure overlapping those ofFIGS. 4A and 4B will be omitted or briefly given.

Referring to FIG. 5A, the display region 500 may include a plurality ofpixel regions and at least one illuminance sensor region when viewed inthe z-axis direction. For example, the green color-based light may reachthe photodiode placed inside the display 330 through an illuminancesensor region 510. The remaining portion of the display region 500 otherthan the pixel regions and the illuminance sensor region 510 may beformed of, for example, a thin film encapsulation (TFE).

Referring to FIG. 5B, the light-emitting/light-receiving layer 460 mayinclude a third photodiode electrode 520 and a third photodiode 530formed thereon. The filter layer 470 may include a third light-receivingfilter 540.

The third photodiode 530 may receive green color-based light through theilluminance sensor region 510. The third photodiode electrode 520 may beformed on the planarization layer 450 through, for example, a depositionprocess. The third photodiode 530 may be formed on the third photodiodeelectrode 520 through, for example, a deposition process. The thirdphotodiode 530 may be implemented as an organic photodiode. The thirdlight-receiving filter 540 may be aligned with the third photodiode 530and filter light received from the third photodiode 530. For example,the third light-receiving filter 540 may filter out a green componentfrom light entering through the illuminance sensor region 510 and outputthe green component to the third photodiode 530.

The third photodiode electrode 520 may be electrically connected to acircuit formed on the substrate 440 through conductive vias 550.

The third photodiode 530 and the third light-receiving filter 540 may bealigned with each other in the illuminance sensor region 510 when viewedin the z-axis direction. Accordingly, the third light-receiving filter540 may filter out a green component from light having entered theilluminance sensor region 510 of the display 330 from the outside andoutput the green component to the third photodiode 530. The thirdphotodiode 530 may convert the green component into an electric signalcorresponding thereto and output the signal to the processor through theADC and the buffer.

The illuminance sensor 590 may be implemented by a combination of thethird photodiode 530 and the third light-receiving filter 540. Theilluminance sensor 590 may be freely placed in various locations on thedisplay 330. For example, the illuminance sensor 590 may include a firstilluminance sensor placed in the display upper region 331, a secondilluminance sensor placed in the display lower region 332, a thirdilluminance sensor placed in the display left region 333, and a fourthilluminance sensor placed in the display right region 334. The processor(e.g., the processor 120 of FIG. 1 ) may calculate a first illuminancevalue by using light information received from the first illuminancesensor, calculate a second illuminance value by using light informationreceived from the second illuminance sensor, calculate a thirdilluminance value by using light information received from the thirdilluminance sensor, and calculate a fourth illuminance value by usinglight information received from the fourth illuminance sensor. Theprocessor may determine a largest value or an average value (e.g., anaverage among others excluding the smallest value) among the illuminancevalues as a representative value representing the ambient illuminance.The processor may set brightness of the display 330 by using therepresentative value. For example, the processor may set a screen of thedisplay 330 to be dark in a dark environment (e.g., an environment inwhich illumination is about 50 Lux or less) and set the screen to bebright in a relatively bright environment. Accordingly, an error inwhich, when a portion of the front cover 320 is covered by an externalobject, a bright environment is misrecognized as a dark environment andthus the display 330 is set to have low brightness may be prevented.

FIGS. 6A, 6B, and 6C illustrate a display including a proximity sensor,according to an embodiment. FIG. 6A is a display region 600 including aproximity sensor in the display 330 of FIG. 3A, and FIG. 6B is across-sectional view taken along a portion EF in the z-axis direction inthe display region 600 of FIG. 6A. FIG. 6C is a cross-sectional viewtaken along a portion GH in the z-axis direction in the display region600 of FIG. 6A. In describing FIGS. 6A, 6B, and 6C, descriptions of anelement and a structure overlapping those of FIGS. 4A and 4B may beomitted or briefly given.

Referring to FIG. 6A, the display region 600 may include a plurality ofpixel regions and at least one proximity sensor region 610 and 620 whenviewed in the z-axis direction. In an embodiment, a plurality ofsub-proximity sensor regions 610 and 620 spaced apart from each othermay be defined as one proximity sensor region 601. For example, acombination of a first sub-proximity sensor region 610 for outputtingand receiving infrared light and a second sub-proximity sensor region620 for outputting and receiving green light may be defined as oneproximity sensor region 601. The remaining portion of the display region600 other than the pixel region and the proximity sensor region 601 maybe formed of, for example, a thin film encapsulation (TFE).

Referring to FIG. 6B, the light-emitting/light-receiving layer 460 mayinclude a first light-emitting diode electrode 630, a firstlight-emitting diode 635 formed thereon, a fourth photodiode electrode640, and a fourth photodiode 645 formed thereon. The firstlight-emitting diode 635 may output IR and the fourth photodiode 645 mayreceive IR. The first light-emitting diode 635 may be implemented as anAMOLED, and the fourth photodiode 645 may be implemented as an organicphotodiode. The filter layer 470 may include a light filter(hereinafter, referred to as a first light-emitting/light receivingfilter) 650 that is aligned with the first sub-proximity sensor region610 when viewed in the z-axis direction. The firstlight-emitting/light-receiving filter 650 may filter out IR from lightreached the first light-emitting/light-receiving filter 650 to outputthe IR. For example, the first light-emitting diode 635 may generate IRunder the control of the processor. The IR output from the firstlight-emitting diode 635 may be output to the outside through the firstlight-emitting/light-receiving filter 650. The IR emitted to the outsidemay be reflected from an external object 603 to enter the firstlight-emitting/light-receiving filter 650. IR may be output to thefourth photodiode 645 through the first light-emitting/light-receivingfilter 650. The fourth photodiode 645 may convert the IR into anelectric signal corresponding thereto and output the signal to theprocessor through the ADC and the buffer.

A first light-emitting diode 635 and a fourth photodiode 645 may beformed in the first light-emitting filter 650 when viewed in the z-axisdirection such that IR output from the first light-emitting diode 635can go out through the first light-emitting/light-receiving filter 650and the IR entered the first sub-proximity sensor region 610 can reachthe fourth photodiode 645 through the firstlight-emitting/light-receiving filter 650 when viewed in the z-axisdirection.

The electrodes 630 and 640 may be electrically connected to a circuitformed on the substrate 440 through conductive vias 651 and 652.

Referring to FIG. 6C, the light-emitting/light-receiving layer 460 mayinclude a second light-emitting diode electrode 660, a secondlight-emitting diode 665 formed thereon, a fifth photodiode electrode670, and a fifth photodiode 675 formed thereon. The secondlight-emitting diode 665 may output green light, and the fifthphotodiode 675 may receive green light. The second light-emitting diode665 may be implemented as an AMOLED, and the fifth photodiode 675 may beimplemented as an organic photodiode. The filter layer 470 may include alight filter (hereinafter, referred to as a secondlight-emitting/light-receiving filter) 680 that is aligned with thesecond sub-proximity sensor region 620 when viewed in the z-axisdirection. The second light-emitting/light-receiving filter 680 mayfilter out green light from light reached the secondlight-emitting/light-receiving filter 680 to output the green light. Forexample, the second light-emitting diode 665 may generate green lightunder the control of the processor. The green light output from thesecond light-emitting diode 665 may be output to the outside through thesecond light-emitting/light-receiving filter 680. The green lightemitted to the outside may be reflected by the external object 603 toreach the second light-emitting/light-receiving filter 680. The greenlight may be output to the fifth photodiode 675 through the secondlight-emitting/light-receiving filter 680. The fifth photodiode 675 mayconvert the green light into an electric signal corresponding theretoand output the signal to the processor through the ADC and the buffer.

The second light-emitting diode 665 and the fifth photodiode 675 may beformed in the second light-emitting/light-receiving filter 680 whenviewed in the z-axis direction such that green light output from thesecond light-emitting diode 665 can go out through the secondlight-emitting/light-receiving filter 680 and the green light enteredthe second sub-proximity sensor region 620 can reach the fifthphotodiode 675 through the second light-emitting/light-receiving filter680 when viewed in the z-axis direction.

The electrodes 660 and 670 may be electrically connected to a circuitformed on the substrate 440 through conductive vias 691 and 692.

A proximity sensor 690 may be implemented by a combination of the firstlight-emitting diode 635, the fourth photodiode 645, and the firstlight-emitting/light-receiving filter 650 and a combination of thesecond light-emitting diode 665, the fifth photodiode 675, and thesecond light-emitting/light-receiving filter 680. The proximity sensor690 may be freely placed in various locations on the display 330. Forexample, the proximity sensor 690 may include a first proximity sensorplaced on the left side, a second proximity sensor placed at the center,and a third proximity sensor placed on the right side, with respect tothe display upper region 331. The processor (e.g., the processor 120 ofFIG. 1 ) may calculate a first distance value by using a time differencebetween a time point at which light is emitted through the firstproximity sensor and a time point at which the light is received throughthe same, calculate a second distance value by using time differencebetween a time point at which light is emitted through the secondproximity sensor and a time point at which the light is received throughthe same, and calculate a third distance value by using a timedifference between a time point at which light is emitted through thethird proximity sensor and a time point at which the light is receivedthrough the same. The processor may determine the distance to anexternal object by using the calculated distance values. For example,the processor may determine a median value or an average value amongdistance values as a representative value representing a distance to anexternal object. The proximity sensor 690 may be disposed in a displayregion event other than the display upper region 331. Accordingly, theprocessor may identify, through the proximity sensor 690, a portion ofthe display 330 to which the object is proximate.

FIG. 7 is a block diagram of an electronic device 700 according tovarious embodiments. FIG. 8 illustrates an execution screen of a cameraapplication displayed on the electronic device 700 of FIG. 7 .

Referring to FIG. 7 , an electronic device (e.g., the electronic device300 of FIGS. 3A and 3B) 700 may include a first camera 710, a secondcamera 715, a light sensor 720, a display 730, a light informationacquisition module 740, a light source recognition module 750, an imagecorrection module 760, a memory 788, and a processor 799 (e.g., theprocessor 120 of FIG. 1 ). The first camera 710 may be disposed on thefront surface of the electronic device 700 together with the display730. The second camera 715 may be disposed on the rear surface of theelectronic device 700. The light sensor 720 may be structurally includedin the display 730. The light sensor 720 may include the light sourcerecognition sensor 490 of FIG. 4B, the illuminance sensor 590 of FIG.5B, or the proximity sensor 690 of FIGS. 6B and 6C. The elements of theelectronic device 700 may be operatively or electrically connected toeach other.

When light information around the electronic device 700 is collectedthrough the light sensor 720 in a state in which pixels (light-emittingdiodes) around the light sensor 720 emit light, the collected lightinformation may be distorted due to light emission of surroundingpixels. To prevent such distortion, the light information acquisitionmodule 740 may be configured to acquire light information from the lightsensor 720 while pixels around the light sensor 720 do not emit light.

The light information acquisition module 740 may activate the lightsensor 720 at a time when the display 730 is momentarily darkened beforethe screen to be displayed on the display 730 is switched to theexecution screen of the camera application, thereby acquiring lightinformation around the electronic device 700 that is free from theinfluence of the display 730 from the light sensor 720.

For example, the processor 799 may recognize a user's touch input to anicon representing a camera application on the home screen displayed onthe display 730 and execute the camera application (e.g., theapplication 146 of FIG. 1 ) according to the touch input. The processor799 may display a first image acquired through the first camera 710according to the execution of the camera application on the display 730such that the same is included on the execution screen of the cameraapplication. The light information acquisition module 740 may observethe execution state of the camera application and recognize the timepoint at which the display 730 becomes dark before the screen to bedisplayed on the display 730 is switched to the execution screen of thecamera application, based on the observation result. The lightinformation acquisition module 740 may activate the light sensor 720 atthe recognized screen switching time point to acquire light informationaround the electronic device 700 from the light sensor 720.

As another example, in response to a user input (e.g., a touch input toa camera switching button included in the execution screen) while asecond image acquired through the second camera 715 is displayed on thedisplay 730, the processor 799 may display the first image acquiredthrough the first camera 710 on the display 730 such that the same isincluded on the execution screen. As a result of observing the executionstate of the camera application, the light information acquisitionmodule 740 may recognize a time point at which the display 730 becomesdark before the second image is switched to the first image. The lightinformation acquisition module 740 may activate the light sensor 720 atthe recognized image switching time point to acquire light informationaround the electronic device 700 from the light sensor 720.

Referring to FIG. 8 , the processor (e.g., the processor 799 of FIG. 7 )may display, on the display (e.g., the display 730 of FIG. 7 ), anexecution screen 810 of the camera application configured by a portion811 configured to interact with a user and a portion 812 configured todisplay an image acquired through the camera. The processor 799 maycontrol the display 730 such that the remaining regions other than theportions 811 and 812 are configured to be dark. The light sensor 720(e.g., the light source recognition sensor 490) may be placed on thedark portions, for example, an upper portion (e.g., the display upperregion 331 of FIG. 3B) 813. Accordingly, the light informationacquisition module 740 may also be configured to acquire lightinformation from the light sensor 720 while the execution screen 810 ofthe camera application is displayed.

The light source recognition module (e.g., the light source recognitionmodule 750 of FIG. 7 ) may recognize a light source type illuminatingthe display 730 by using the light information received from the lightsource recognition sensor 490. For example, the light source recognitionmodule 750 may calculate a first intensity value representing theintensity of light in a broad band from the light information acquiredfrom the first photodiode 463 a of the light source recognition sensor490. The light source recognition module 750 may calculate a secondintensity value representing the intensity of visible light from thelight information acquired from the second photodiode 463 b of the lightsource recognition sensor 490. The light source recognition module 750may determine whether the light source is an artificial light source orsunlight by using the two intensity values. For example, the lightsource recognition module 750 may identify a light source type by usinga value obtained by dividing a difference between the two intensityvalues by the second intensity value.

The image correction module (e.g., the image correction module 760 ofFIG. 7 ) may correct an image acquired from the first camera 710, basedon the identified light source type, such that the image has no colordistortion. For example, the image correction module 760 may determinewhether the electronic device 700 is located indoors or outdoors, basedon the identified light source type. When it is determined that theelectronic device is located outdoors, the image correction module 760may perform AWB for removing color twists (e.g., color distortion)caused by sunlight from the image.

At least one of modules 740, 750, and 760 may be stored as instructionsin memory 788 (e.g., the memory 130 of FIG. 1 ) and may be executed bythe processor 799 (e.g., the processor 120 of FIG. 1 ). At least one ofthe modules 740, 750, and 760 may be executed by a processor (e.g., theauxiliary processor 123) specialized for an image processing process.

In accordance with an embodiment, an electronic device (e.g., theelectronic device 300 of FIGS. 3A and 3B) may include: a front coverforming a front surface of the electronic device; a rear cover forming arear surface opposite to the front surface; a display placed between thefront cover and the rear cover and visually exposed through the frontcover; a first camera disposed on the front surface; and a processoroperatively connected to the first camera and the display. The display(e.g., the display 330 of FIG. 3A) may be divided into a display regionand a sensor region when facing the front surface. The display mayinclude: a light-emitting/light-receiving layer including light-emittingdiodes disposed in the display region and at least one photodiodedisposed in the sensor region; and a filter layer placed between thefront cover and the light-emitting/light-receiving layer and includinglight-emitting filters aligned with the light-emitting diodes in thedisplay region, and at least one light-receiving filter aligned with theat least one photodiode in the sensor region. The processor (e.g., theprocessor 799 of FIG. 7 ) may be configured to receive, from the atleast one photodiode, light information related to light passed throughthe at least one light-receiving filter to be received by the at leastone photodiode, and perform, by using the light information, a functionrelated to an image acquired from the first camera to be displayed onthe display.

The sensor region may include a first sensor region (e.g., the lightsource recognition sensor region 420 of FIG. 4A) configured to recognizea light source type. The at least one light-receiving filter mayinclude: a first light-receiving filter (e.g., the first light-receivingfilter 473 a of FIG. 4B) disposed in the first sensor region andconfigured to filter out visible light and infrared light componentsfrom light received from the outside through the front cover; and asecond light-receiving filter (e.g., the second light-receiving filter473 b of FIG. 4B) disposed in the first sensor region and configured tofilter out a visible light component from light received from theoutside through the front cover. The at least one photodiode mayinclude: a first photodiode (e.g., the first photodiode 463 a of FIG.4B) aligned with the first light-receiving filter in the first sensorregion and configured to respond to light having passed through thefirst light-receiving filter; and a second photodiode (e.g., the secondphotodiode 463 b of FIG. 4B) aligned with the second light-receivingfilter in the first sensor region and configured to respond to lighthaving passed through the second light-receiving filter.

The processor may be configured to acquire information related to alight source type by using light information collected from the firstphotodiode and the second photodiode, and correct a first image acquiredfrom the first camera, based on the acquired information, to display thecorrected first image on the display.

The sensor region may include a second sensor region (e.g., theilluminance sensor region 510 of FIGS. 5A and 5B) for measuring theilluminance around the electronic device. The at least onelight-receiving filter may include a third light-receiving filter (e.g.,the third light-receiving filter 540 of FIG. 5B) disposed in the secondsensor region and configured to filter out a specified color componentfrom light received from the outside through the front cover. The atleast one photodiode may include a third photodiode (e.g., the thirdphotodiode 530 of FIG. 5B) aligned with the third light-receiving filterin the second sensor region and configured to respond to light havingpassed through the third light-receiving filter.

The processor may be configured to acquire information related to theilluminance around the electronic device by using light informationcollected from the third photodiode, and set the brightness of thedisplay, based on the acquired information. The specified colorcomponent may be a green component.

The sensor region may include a third sensor region (e.g., the proximitysensor region 601 of FIG. 6A) for recognizing the proximity of an objectwith respect to the electronic device. The filter layer may furtherinclude a first light-emitting/light-receiving filter (e.g., the firstlight-emitting/light-receiving filter 650 of FIG. 6B) disposed in thethird sensor region and configured to filter out a specified lightcomponent in a first wavelength band from incident light. Thelight-emitting/light-receiving layer may further include: a firstlight-emitting diode (e.g., the first light-emitting diode 635 of FIG.6B) aligned with the first light-emitting/light-receiving filter in thethird sensor region and configured to generate light in the firstwavelength band; and a fourth photodiode (e.g., the fourth photodiode645 of FIG. 6B) configured to respond to light having passed through thefirst light-emitting/light-receiving filter.

The filter layer may further include a secondlight-emitting/light-receiving filter (e.g., the secondlight-emitting/light-receiving filter 680 of FIG. 6C) disposed in thethird sensor region and configured to filter out a specified lightcomponent in a second wavelength band from incident light. Thelight-emitting/light-receiving layer may further include: a secondlight-emitting diode (e.g., the second light-emitting diode 665 of FIG.6C) aligned with the second light-emitting/light-receiving filter in thethird sensor region and configured to generate light in the secondwavelength band; and a fifth photodiode (e.g., the fifth photodiode 675of FIG. 6C) configured to respond to light having passed through thesecond light-emitting/light-receiving filter. One of the firstwavelength band and the second wavelength band may be a wavelength bandcorresponding to infrared light, and the other one may be a wavelengthband corresponding to green light.

The sensor region may be placed on the outer edge of the display. Theouter edge of the display may be divided into a display upper region, adisplay lower region, a display left region, and a display right regionwhen facing the front surface, and the sensor region may be placed in atleast one region of the display regions.

The processor may be configured to receive light information from the atleast one photodiode while a light-emitting diode placed around the atleast one photodiode does not emit light.

The processor may be configured to activate the at least one photodiodeat a time when the display becomes dark before the screen to bedisplayed on the display is switched to an execution screen of a cameraapplication, thereby receiving light information from the at least onephotodiode.

The electronic device may further include a second camera disposed onthe rear surface, and the processor may be configured to activate the atleast one photodiode at a time when the display becomes dark before animage to be displayed on the display is switched from a second imageacquired through the second camera to a first image acquired through thefirst camera, thereby receiving light information from the at least onephotodiode.

The execution screen of the camera application to be displayed on thedisplay may include: a first portion for interacting with a user; asecond portion for displaying an image acquired through the firstcamera; and a third portion configured to be dark, and the sensor regionmay be placed in a display region corresponding to the third portion.

In accordance with an embodiment, the electronic device (e.g., theelectronic device 300 of FIG. 3 ) may include: a front cover forming afront surface of the electronic device; a rear cover forming a rearsurface opposite to the front surface; and a display placed between thefront cover and the rear cover, visually exposed through the frontcover, and divided into a display region and a sensor region forrecognizing a light source, when facing the front surface. The display(e.g., the display 330 of FIG. 4B) may include: alight-emitting/light-receiving layer (e.g., thelight-emitting/light-receiving layer 460 of FIG. 4B) includinglight-emitting diodes disposed in the display region, a first photodiodedisposed in a first sub-sensor region of the sensor region, and a secondphotodiode disposed in a second sub-sensor region of the sensor region;and a filter layer (e.g., the filter layer 470 of FIG. 4B) placedbetween the front cover and the light-emitting/light-receiving layer andincluding light-emitting filters aligned with the light-emitting diodesin the display region, a first light-receiving filter aligned with thefirst photodiode in the first sub-sensor region, and a secondlight-receiving filter aligned with the second photodiode in the secondsub-sensor region. The first light-receiving filter may filter outvisible light and infrared light components from light received from theoutside through the front cover. The second light-receiving filter mayfilter out a visible light component from light received from theoutside through the front cover. The first photodiode may generate anelectrical signal in response to the visible light and infrared lightcomponents having passed through the first light-receiving filter. Thesecond photodiode may generate an electrical signal in response to thevisible light component having passed through the second light-receivingfilter.

The embodiments of the disclosure in the specification and drawings aremerely provided for specific examples in order to easily explain thetechnical contents according to the embodiments of the disclosure andhelp comprehension of the embodiments of the disclosure, and do notlimit the scope of the embodiments of the disclosure. Therefore, inaddition to the embodiments disclosed herein, all changes ormodifications derived from the technical ideas of various embodiments ofthe disclosure should be interpreted as being included in the scope ofvarious embodiments of the disclosure.

While the disclosure has been described with reference to variousembodiments, various changes may be made without departing from thespirit and the scope of the present disclosure, which is defined, not bythe detailed description and embodiments, but by the appended claims andtheir equivalents.

What is claimed is:
 1. An electronic device comprising: a front coverforming a front surface of the electronic device; a rear cover forming arear surface opposite to the front surface; a display placed between thefront cover and the rear cover and visually exposed through the frontcover; a first camera disposed on the front surface; and a processoroperatively connected to the first camera and the display, wherein thedisplay is divided into a display region and a sensor region when facingthe front surface, and comprises: a light-emitting/light-receiving layercomprising light-emitting diodes disposed in the display region, and atleast one photodiode disposed in the sensor region; and a filter layerplaced between the front cover and the light-emitting/light-receivinglayer and comprising light-emitting filters aligned with thelight-emitting diodes in the display region, and at least onelight-receiving filter aligned with the at least one photodiode in thesensor region, and wherein the processor is configured to receive, fromthe at least one photodiode, light information related to light passedthrough the at least one light-receiving filter to be received by the atleast one photodiode, and perform, by using the light information, afunction related to an image acquired from the first camera to bedisplayed on the display.
 2. The electronic device of claim 1, whereinthe sensor region comprises a first sensor region configured torecognize a light source type, and wherein the at least onelight-receiving filter comprises: a first light-receiving filterdisposed in the first sensor region and configured to filter out visiblelight and infrared light components from light received from the outsidethrough the front cover; and a second light-receiving filter disposed inthe first sensor region and configured to filter out a visible lightcomponent from light received from the outside through the front cover,and wherein the at least one photodiode comprises: a first photodiodealigned with the first light-receiving filter in the first sensor regionand configured to respond to light having passed through the firstlight-receiving filter; and a second photodiode aligned with the secondlight-receiving filter in the first sensor region and configured torespond to light having passed through the second light-receivingfilter.
 3. The electronic device of claim 2, wherein the processor isconfigured to: acquire information related to a light source type byusing light information collected from the first photodiode and thesecond photodiode, and correct a first image acquired from the firstcamera, based on the acquired information, to display the correctedfirst image on the display.
 4. The electronic device of claim 1, whereinthe sensor region comprises a second sensor region for measuring theilluminance around the electronic device, wherein the at least onelight-receiving filter comprises a third light-receiving filter disposedin the second sensor region and configured to filter out a specifiedcolor component from light received from the outside through the frontcover, and wherein the at least one photodiode comprises a thirdphotodiode aligned with the third light-receiving filter in the secondsensor region and configured to respond to light having passed throughthe third light-receiving filter.
 5. The electronic device of claim 4,wherein the processor is configured to acquire information related tothe illuminance around the electronic device by using light informationcollected from the third photodiode, and set the brightness of thedisplay, based on the acquired information.
 6. The electronic device ofclaim 4, wherein the specified color component is a green component. 7.The electronic device of claim 1, wherein the sensor region comprises athird sensor region for recognizing the proximity of an object withrespect to the electronic device, wherein the filter layer furthercomprises a first light-emitting/light-receiving filter disposed in thethird sensor region and configured to filter out a specified lightcomponent in a first wavelength band from incident light, and whereinthe light-emitting/light-receiving layer further comprises: a firstlight-emitting diode aligned with the firstlight-emitting/light-receiving filter in the third sensor region andconfigured to generate light in the first wavelength band; and a fourthphotodiode configured to respond to light having passed through thefirst light-emitting/light-receiving filter.
 8. The electronic device ofclaim 7, wherein the filter layer further comprises a secondlight-emitting/light-receiving filter disposed in the third sensorregion and configured to filter out a specified light component in asecond wavelength band from incident light, and wherein thelight-emitting/light-receiving layer further comprises: a secondlight-emitting diode aligned with the secondlight-emitting/light-receiving filter in the third sensor region andconfigured to generate light in the second wavelength band; and a fifthphotodiode configured to respond to light having passed through thesecond light-emitting/light-receiving filter.
 9. The electronic deviceof claim 8, wherein one of the first wavelength band and the secondwavelength band is a wavelength band corresponding to infrared light,and the other one is a wavelength band corresponding to green light. 10.The electronic device of claim 1, wherein the sensor region is placed onthe outer edge of the display.
 11. The electronic device of claim 10,wherein the outer edge of the display is divided into a display upperregion, a display lower region, a display left region, and a displayright region when facing the front surface, and wherein the sensorregion is placed in at least one region of the display regions.
 12. Theelectronic device of claim 1, wherein the processor is configured toreceive light information from the at least one photodiode while alight-emitting diode placed around the at least one photodiode does notemit light.
 13. The electronic device of claim 12, wherein the processoris further configured to activate the at least one photodiode andreceive light information from the activated at least one photodiode,when the display becomes dark before a screen to be displayed on thedisplay is switched to an execution screen of a camera application. 14.The electronic device of claim 12, further comprising a second cameradisposed on the rear surface, wherein the processor is configured toactivate the at least one photodiode at a time and receive lightinformation from the at least one photodiode, when the display becomesdark before an image to be displayed on the display is switched from asecond image acquired through the second camera to a first imageacquired through the first camera.
 15. The electronic device of claim 1,wherein the execution screen of the camera application to be displayedon the display comprises: a first portion configured to interact with auser; a second portion configured to display an image acquired throughthe first camera; and a third portion configured to be dark, and whereinthe sensor region is placed in a display region corresponding to thethird portion.
 16. An electronic device comprising: a front coverforming a front surface of the electronic device; a rear cover forming arear surface opposite to the front surface; and a display placed betweenthe front cover and the rear cover, visually exposed through the frontcover, and divided into a display region and a sensor region forrecognizing a light source, when facing the front surface, wherein thedisplay comprises: a light-emitting/light-receiving layer comprisinglight-emitting diodes disposed in the display region, a first photodiodedisposed in a first sub-sensor region of the sensor region, and a secondphotodiode disposed in a second sub-sensor region of the sensor region;and a filter layer placed between the front cover and thelight-emitting/light-receiving layer and comprising light-emittingfilters aligned with the light-emitting diodes in the display region, afirst light-receiving filter aligned with the first photodiode in thefirst sub-sensor region, and a second light-receiving filter alignedwith the second photodiode in the second sub-sensor region, wherein thefirst light-receiving filter is configured to filter out visible lightand infrared light components from light received from the outsidethrough the front cover, wherein the second light-receiving filter isconfigured to filter out a visible light component from light receivedfrom the outside through the front cover, wherein the first photodiodeconfigured to generate an electrical signal in response to visible lightand infrared light components having passed through the firstlight-receiving filter, and wherein the second photodiode is configuredto generate an electrical signal in response to a visible lightcomponent having passed through the second light-receiving filter.